The OSFP end is designed with heat‑sink fins for improved thermal dissipation, while the QSFP112 end has no top fins and uses the heat dissipation structure of the NIC cage.These high‑efficiency links are ideal for medium‑range interconnections in data centers, AI/HPC clusters and between racks.
Product Details
Features and Advantages
▸ Low latency and low insertion loss
▸ Low power consumption, hot-pluggable
▸ Compliant with OSFP MSA Rev5.0, QSFP112 MSA, IEEE 802.3ck and CMIS 5.0 standards
▸ 8x 112G-PAM4 to quad 2x 112G-PAM4
▸ Low bit error rate (BER)
Markets and Applications
▸ High Performance Computing (HPC)
▸ The Network Interface Card (NIC)
▸ The AI Data Center
▸ Data storage